Patent · US Expired

Solderable adhesive layer

US4659378A · kind A · utility

7Cited by

5References

1Claims

0Family size

Assignee

International Standard Electric Corporation · US

Inventors

Hans Volz · Schwieberdingen, DE
Peter Kersten · Leonberg, DE

Key dates

Filing date	Jun 22, 1984
Grant date	Apr 21, 1987
Priority date	—
Expiry date	Jun 22, 2004

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/244
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Electrical contacts to or mechanical connections between components and provided by using a thin layer of an alloy consisting of metals and metalloids. Such a layer shows excellent adhesion to glass or semiconductor substrates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.