Continuous process for the manufacture of printed circuit boards
US4659425A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1986 |
| Grant date | Apr 21, 1987 |
| Priority date | — |
| Expiry date | Feb 3, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A continuous method for the manufacture of a circuit board wherein a coating of a solvent-free thermosetting resin is applied to the surface of a metal foil. The resin coated foil is advanced into contact with a reinforcing cloth sheet layer to form a foil/cloth assembly. The assembly is continuously conveyed between a pair of endless belts revolving in opposite directions with mutually facing surfaces, the belts being heated to the curing temperature of the resin whereby the belts are pressed against the assembly to continuously compact the assembly and cure the resin to form a composite product which can then be circuitized from a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.