Circuit substrate having high thermal conductivity
US4659611A · kind A · utility
55Cited by
10References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1985 |
| Grant date | Apr 21, 1987 |
| Priority date | — |
| Expiry date | Feb 27, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high thermal conductivity circuit substrate is provided comprising a sintered aluminum nitride ceramic substrate consisting essentially of one member selected from the group of yttrium, the rare earth metals and the alkali earth metals and an electrically conductive thick film paste for a conductive layer formed on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.