Solid solution of amine and polymerized phenol as epoxy resin cure accelerator
US4659779A · kind A · utility
42Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1986 |
| Grant date | Apr 21, 1987 |
| Priority date | — |
| Expiry date | Apr 2, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Compositions useful as adhesives, sealants, laminating resins and coatings comprise PA1 (a) an epoxide resin PA1 (b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and PA1 (c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a polymer of an unsaturated phenol. Typical nitrogen bases used in (c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.