High density multi-layered integrated circuit package
US4659931A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 1985 |
| Grant date | Apr 21, 1987 |
| Priority date | — |
| Expiry date | May 8, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are disclosed for forming a high density multi-layered detector array module. The module body is formed of multiple non-conductive, thin film layers supporting a plurality of electronic devices. The module utilizes conductive patterns formed on the surface of a plurality of the layers to effect connections between and among electronic devices and external electronics. A detector array and an electrical interconnect may be joined to end portions of the module, in electrical communication with the layer conductive patterns. Transverse conductive connectors such as vias are provided within the module extending between the layers. Connections between and among the electronic devices and external electronics are thereby supported by transverse connections within the module and the electrical interconnect. The interconnect may be formed as a back plane extending transverse to the plane of the layers or as a plurality of discrete conductive strips disposed on the surface of one or more of the layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.