Intermediate normal metal layers in superconducting circuitry
US4660061A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1985 |
| Grant date | Apr 21, 1987 |
| Priority date | — |
| Expiry date | Dec 16, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/874
Abstract
A thin, nominally 150 angstroms, normal metal layer, nominally the noble normal metal palladium, sandwiched intermediate between two superconducting layers, nominally niobium, supports totally superconducting current flow therethrough such normal metal layer by the quantum mechanical tunneling effect. Such a thin normal metal layer is useful as a stop etch layer for fabrication process control, including especially the selective niobium anodization process, as an oxidation resistant or immune layer to which totally superconducting electrical contact may be reliably made such as by soldering, and as a patterned resistor in those regions of the substrate plane where such thin normal metal layer is not sandwiched by superconducting layers. Particularly concerning such stop etch function, a thin normal layer of palladium will serve as a stop etch layer to the etching of niobium while not precluding totally superconducting contact therethrough such thin palladium layer. Particularly concerning the electrical contact function, a superconducting wire, nominally niobium, may be soldered with lead-tin or indium-tin to a thin normal metal layer of palladium in the formation of a totally supe…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.