Heat insulating means for piping subjected to thermal, hydrostatic and mechanical stresses, positioning thereof and processes for forming said insulating means
US4660861A · kind A · utility
35Cited by
21References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 1984 |
| Grant date | Apr 28, 1987 |
| Priority date | — |
| Expiry date | Dec 28, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S285/915
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
The present invention relates to improvements made to heat insulating means for piping subjected to high thermal, hydrostatic and mechanical stresses. The new insulating means comprises a plurality of sectors or layers made from a lacunal insulating material enclosing air, which sectors or layers are bonded together by sheets or layers of elastomer, and having undergone curing at a temperature less than or equal to 120.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.