Process for activating substrate surfaces for electroless metallization

US4661384A · kind A · utility

Assignee

• BAYER HEALTHCARE LLC · DE

Inventors

• Kirkor Sirinyan · Bensberg, DE
• Rudolf Merten · Leverkusen, DE
• Gerhard D. Wolf · Dormagen, DE

Key dates

• Filing date: Jun 20, 1985
• Grant date: Apr 28, 1987
• Expiry date: Jun 20, 2005

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C18/28
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Activation baths containing an organometallic compound based on elements of sub-group 1 or 8 of the periodic table with a "guest/host" interrelationship are outstandingly suitable for electroless metallization of preferably non-metallic substrates. Activators of palladium compounds and cyclic crown ethers are particularly suitable.