Composite of metal and resin having electrolytically reduced metal layer and process for producing the same
US4661417A · kind A · utility
18Cited by
7References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 1984 |
| Grant date | Apr 28, 1987 |
| Priority date | — |
| Expiry date | Dec 31, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite of metal and resin comprising a resin layer and a metal layer having a surface roughness of a degree giving a lusterless appearance and a color of olive brown to black closely adhered through said surface to the resin layer is excellent in adhesive strength between the metal and resin layers, the metal layer being excellent in acid resistance, and is suitable for producing printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.