Epoxy resin composition and process for preparing laminates therefrom
US4661568A · kind A · utility
13Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1985 |
| Grant date | Apr 28, 1987 |
| Priority date | — |
| Expiry date | Sep 9, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The epoxy resin composition is comprised of an epoxy resin, a solvent and a hardener which is the reaction product of a hexa-alkyl ether of a methylol melamine having the general formula (I), wherein each R, independently, is an alkyl radical having from 1 to 4 carbon atoms with a polyhydric phenol and, optionally, a monohydric phenol, with the phenol compound(s) having been employed in an amount to provide a ratio of at least one reactive phenolic hydroxy group for each alkoxy group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.