High temperature epoxy resin composition with reduced viscosity
US4661578A · kind A · utility
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10References
19Claims
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Key dates
| Filing date | Nov 25, 1985 |
| Grant date | Apr 28, 1987 |
| Priority date | — |
| Expiry date | Nov 25, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F283/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition of matter comprising either at least about 80 wt. % of a monomeric or oligomeric polyglycidyl ether of tris(hydroxyphenyl)alkanes; PA0 or at least about 80 wt. % of an epoxy phenol-formaldehyde or cresol-formaldehyde novolac resin in monomeric or oligometric form, e.g., dimers, trimers, tetramers and some higher oligomers in an amount of as little as 5 up to about 95 wt. %; PA0 in combination with from about 0.1 to about 20 wt. % of a divinyl benzene compound of the formula: ##STR1## wherein each A independently represents H, F, Cl, Br or CH.sub.3 but no more than 2 of A are CH.sub.3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.