Magnetically sealed multichip integrated circuit package
US4661886A · kind A · utility
16Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1985 |
| Grant date | Apr 28, 1987 |
| Priority date | — |
| Expiry date | Oct 3, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A magnetically sealed integrated circuit package includes a substrate having a cavity for holding multiple integrated circuit die, a lid for covering the cavity to protect the die, a ferromagnetic seal ring which is fixed to the substrate around the die, and a magnet which is fixed to the lid and coincides in shape to the seal ring for magnetically attracting the seal ring to hold the lid in place when the lid covers the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.