Method of making an abrasive cutting element
US4662896A · kind A · utility
55Cited by
8References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 19, 1986 |
| Grant date | May 5, 1987 |
| Priority date | — |
| Expiry date | Feb 19, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/008
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive compact is made by a method comprising the steps of providing a circular cylindrical substrate having an upper with a non-circular recess therein defined by non-intersecting side walls. The recess is filled with diamond grains and is positioned in a press. The substrate and diamond grains are subjected to high temperature and pressure conditions in the press to sinter the diamond grains and bond the sintered diamond grains to the substrate in the form of a non-circular diamond layer. The portions of the substrate not covered by the diamond layer are removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.