Process and composition for sensitizing articles for metallization
US4662944A · kind A · utility
4Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1976 |
| Grant date | May 5, 1987 |
| Priority date | — |
| Expiry date | Dec 22, 1996 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/181
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including cuprous ions and stannous ions thereby absorbing on the surface in situ at least said cuprous ions; thereafter treating the surface with a second medium to decrease the solubility of the cuprous ions and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said cuprous ions into a catalytically-active state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.