Microwave method of perforating a polymer film
US4662969A · kind A · utility
19Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1985 |
| Grant date | May 5, 1987 |
| Priority date | — |
| Expiry date | Jan 14, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1057
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming perforations in polymer film includes the steps of forming a conductive film pattern on the film preferably in a bow tie shape using a material with a moderate resistivity and applying a microwave field across the film for a few seconds whereupon sufficient electrical energy is dissipated in the conductive spot to perforate the polymer. This method is operative even when the polymer film is laminated between layers of other dielectric material prior to the microwave processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.