Planarization method and technique for isolating semiconductor islands
US4662986A · kind A · utility
5Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 27, 1985 |
| Grant date | May 5, 1987 |
| Priority date | — |
| Expiry date | Jun 27, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76224
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for producing planarized semiconductor surfaces and for isolating semiconductor islands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.