A method and apparatus for surface mount compatible connector system with mechanical integrity
US4663815A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1985 |
| Grant date | May 12, 1987 |
| Priority date | — |
| Expiry date | Oct 1, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/8832
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical component for mechanical mouting and electrical connection with respect to plated through holes of a printed circuit board compatibly with a surface mount attaching process includes an electrically non-conducting body, plural generally elongate contacts extending from the body for insertion into such plated through holes, and the component having a reservoir for retaining solder type material for melting, for flow into respective plated through holes, and for re-solidifying to mechanically and electrically couple the component to such printed circuit board. Preferably the component is a connector, such as a header, and the contact pins or leads thereof provide an interface connection between the printed circuit board and a separate or portable connector. A method for attaching such an electrical component to a printed circuit board compatibly with surface mount attaching processes, a method for placing solder in the reservoirs of such electrical component, and apparatus to carry out such methods also are part of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.