Heat-sensitive recording material
US4665411A · kind A · utility
8Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1985 |
| Grant date | May 12, 1987 |
| Priority date | — |
| Expiry date | May 16, 2005 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03C1/61
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A heat-sensitive recording material is described, comprising a recording layer containing a diazo compound and a coupling component provided on a support, wherein one of said diazo compound and said coupling component is contained in microcapsules together with an organic solvent having a dielectric constant of from 5.2 to 7.5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.