Oxymethylene polymer molding compositions having enhanced resistance to black speck formation
US4666995A · kind A · utility
6Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 1986 |
| Grant date | May 19, 1987 |
| Priority date | — |
| Expiry date | May 15, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/927
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The black speck formation which occurs during the compounding and molding of admixtures of oxymethylene polymers and polyamides having a melting or softening point below that of the oxymethylene polymer can be reduced by adding the polyamide to the oxymethylene polymer as a dispersion of the polyamide in a carrier resin which is inert to the oxymethylene polymer and has a melting or softening point below that of the oxymethylene polymer. The polyamide comprises less than about 50 weight percent of the dispersion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.