Semiconductor chip interface
US4667219A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1984 |
| Grant date | May 19, 1987 |
| Priority date | — |
| Expiry date | Apr 27, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15173
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts of the semiconductor chip. A plurality of transmission elements are located proximate the connector plate opposite from the semiconductor chip. A plurality of flexible conductors extend through the respective apertures of the connector plate. The flexible conductors are electrically coupled to the contacts of the chip and to the transmission elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.