Method for manufacturing electronic card modules

US4667403A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Egon Edinger
• Joachim Koetter · Munich, DE
• Dietmar Kraske · Munich, DE
• Klaus Krumrey · Speyer, DE
• Joerg Mayser · Bruchsal, DE
• Ulrich Michael · Hannover, DE

Key dates

• Filing date: Apr 24, 1985
• Grant date: May 26, 1987
• Expiry date: Apr 24, 2005

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/5137
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A method and system to produce card modules by assembling and soldering components on a printed circuit board, characterized by retrieving specific printed circuit board-type from a printed circuit board storage having several types in response to a command signal, reading an identification code on the printed circuit board to obtain information concerning the board and then in response to this information, conveying the circuit board through selective processing stations for assembling components on the circuit board, through-stations for soldering the components on the circuit board to form an electronic card module and then through-stations for testing the card module in response to information obtained during reading. The testing station can also include one or more stations for performing the steps of fault-locating and for repairing located faults as necessary.