Mounting beam for preparing wafers
US4667650A · kind A · utility
7Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1985 |
| Grant date | May 26, 1987 |
| Priority date | — |
| Expiry date | Nov 21, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/0082
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A self-dressing mounting beam for slicing wafers from ingots of various materials, especially semiconductors, is described. The mounting beam is a composite material comprising an organic polymer, particles of abrasive and hollow microspheres. The ingot is mounted on the beam and sliced using an inside diameter saw. The saw penetrates the mounting beam as well as the ingot, so that the self-dressing feature is realized with each pass of the blade.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.