Wire bonding tool
US4667867A · kind A · utility
12Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1986 |
| Grant date | May 26, 1987 |
| Priority date | — |
| Expiry date | Jul 1, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/04953
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wire bonding tool is disclosed which comprises a metal or cermet stem and a silicon nitride containing tip. The tip is made of a silicon nitride containing composite which is electrically conducting. One end of the tip is fixedly mounted to one end of the stem.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.