Soldering methods and devices
US4667869A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1984 |
| Grant date | May 26, 1987 |
| Priority date | — |
| Expiry date | Apr 13, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/723
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A heat-recoverable soldering device comprises a heat-recoverable member containing a fusible solder insert, solder flux and a thermochromic composition which undergoes a visible change from a colored to a colorless state at the soldering temperature. Solderable substrates are positioned within the device and heat is applied until the soldering temperature has been reached, as indicated by a color change of the thermochromic composition. The soldering temperature is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Typically this temperature is at least about 20.degree. C. above the melting temperature of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.