Heat sealable multilayer films with low permeability to gas and their use as packaging material
US4668575A · kind A · utility
30Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 1986 |
| Grant date | May 26, 1987 |
| Priority date | — |
| Expiry date | May 9, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31928
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Heat sealable, composite film comprising a polypropylene film, at least one adhesion layer, at least one gas-barrier layer and at least one heat-sealing layer of a linear statistical ethylene copolymer of low density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.