Bonding electrical conductors and bonded products
US4668581A · kind A · utility
19Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1985 |
| Grant date | May 26, 1987 |
| Priority date | — |
| Expiry date | Jan 22, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Bonds between a contact area of a circuit of a semiconductor and a conductor are formed by applying a rotating tool to an opposed surface of the conductor or to an intervening material superposed on it. The conductor may be laminated to one or more layers of insulant material and when that material is for example polyester, the bond may be formed without prior removal of the insulant from between the contact area and the conductor; it is displaced by the effect of the tool. The areas and conductors may be in an array and the tool be brought across the members of the array in succession.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.