Semiconductor junction temperature emulator
US4669025A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1986 |
| Grant date | May 26, 1987 |
| Priority date | — |
| Expiry date | Apr 21, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S388/934
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present device includes a resistor network wherein the values of the resistors are chosen such that the heat generated by current passing through the resistors will be substantially equal to heat generated at a semiconductor junction which is to be cooled. The present device further includes a heat sink which is substantially identical to the heat sink employed to withdraw heat from the semiconductor junction to be cooled. Accordingly, the present device provides heat which is identical to the heat generated at the semiconductor junction and which heat remains ambient to the semiconductor junction to be cooled. The present device further includes a sensor which converts temperature to an electrical signal and which is located substantially in the center of the resistor network and at a distance from the heat sink that approximates the position of the semiconductor junction from its heat sink. The temperature to electrical signal sensor generates a control electrical signal whose value is commensurate with the temperature of the air at the location of the temperature to electrical signal sensor and that temperature is substantially identical to the temperature at the semiconduct…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.