Process and apparatus for producing metal-laminated base material for printed circuit boards

US4670080A · kind A · utility

Assignee

• President Engineering Corporation · CH

Inventors

• Lothar Schwarz · Oberkirch, DE
• Friedel Ueberberg · Lindlar, DE
• Rudolf Kuehne · Cologne, DE
• Dieter Fischer · Steinfeld (Oldenburg), DE

Key dates

• Filing date: Apr 2, 1985
• Grant date: Jun 2, 1987
• Expiry date: Apr 2, 2005

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1545
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A metal-laminated base material for printed circuit boards is produced in a double-belt press. Sheets of laminated material impregnated with an accelerated resin system and prehardened are preheated in a preheating zone, before running into a pressure-effective zone of the double-belt press, and are supplied together with the metal foils to the heating region of the pressure-effective zone. Here, the individual layers are pressed to form the base material. The base material is preferably cooled under pressure in a cooling region of the pressure-effective zone, if appropriate heat-treated, trimmed at the edges and cut to length. The process provides uniform base-material boards of perfect quality.