Process and apparatus for producing semi-conductor foils
US4670096A · kind A · utility
38Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1985 |
| Grant date | Jun 2, 1987 |
| Priority date | — |
| Expiry date | May 6, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S117/915
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In the production of a semi-conductor foil by solidification of a liquid semi-conductor on a horizontal support, the improvement which comprises positioning a molding body on the horizontal support, supplying the liquid semi-conductor to the molding body, and effecting relative movement between the molding body and support in a direction parallel to the support. Thereby fault-free silicon foils can readily be produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.