Heat sink and interconnection arrangement for series connected power diodes
US4670817A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1984 |
| Grant date | Jun 2, 1987 |
| Priority date | — |
| Expiry date | Oct 1, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20463
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal base plate has two spaced thermally conductive ceramic bars fixed to one surface. The outwardly facing surface of the bars has spaced conductive pads. A plurality of diodes which are of alternating opposite polarity have axially extending leads extending between the bars in spaced parallel relationship with respect to one another, and are soldered to the conductive pads on the bars to define a series connection of the diodes. The suspended diodes and their leads are then encapsulated in a body of polymerizable material containing thermally conductive electrically insulative particles suspended therein such that the particles occupy more than about 75% of the encapsulating mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.