Grinding tool
US4671021A · kind A · utility
19Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1985 |
| Grant date | Jun 9, 1987 |
| Priority date | — |
| Expiry date | Oct 21, 2005 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/342
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A grinding tool has diamond superabrasive grains as the abrasive and a bond to retain the abrasive grains. The bond is made of organic polymer or metal and contains as a filler both a solid film-forming lubricant and finely divided diamond superabrasive grains having a grain size smaller than one-third that of the diamond superabrasive grains as the abrasive. The grinding tool of this invention is suitable for grinding a hard cutting material such as cutting tools made of titanium nitride cermet and exhibits outstanding cutting performance and durability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.