Heat pump system
US4671075A · kind A · utility
5Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 1986 |
| Grant date | Jun 9, 1987 |
| Priority date | — |
| Expiry date | Jun 10, 2006 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2700/2101
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump system in which a by-passing passage is provided for connecting a high pressure segment of a primary refrigerant passage with a low pressure segment of the primary refrigerant passage, a secondary pressure reduction means is disposed in the by-passing passage to produce two phases of the refrigerant (gas-liquid state) and the pressure of the refrigerant is continuously detected by sensing saturated temperatures of the two phases both upstream and downstream of the secondary pressure reduction means for controlling the operation of the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.