Method for preparing a printed circuit board with solder plated circuit and through-holes
US4671854A · kind A · utility
22Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1986 |
| Grant date | Jun 9, 1987 |
| Priority date | — |
| Expiry date | Apr 24, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a method for preparing a printed circuit board with solder plated circuit and through-holes, using a specifically prepared photoresist material and a combination of exposure, development, solder plating and etching means. This method is particularly useful for the preparation of a printed circuit-board with solder plated circuit and through-holes bearing a high density circuit pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.