Oxymethylene copolymerizate molding compositions with reduced formaldehyde emission in the thermoplastic processing

US4672083A · kind A · utility

Assignee

• Degussa AG · DE

Inventors

• Herbert Amann · Hanau, DE
• Gerhard Morlock · Hanau, DE
• Egbert Schola · Eisenstadt, AT

Key dates

• Filing date: May 21, 1986
• Grant date: Jun 9, 1987
• Expiry date: May 21, 2006

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K5/3492
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The formaldehyde emission in the thermoplastic processing of antioxidant containing oxymethylene copolymer molding compositions is reduced considerably if these molding compositions additionally contain on the surface or homogeneously mixed in a specifically defined formaldehyde binding material which contains in the molecule at least two 4,6-diamino-1,3,5-triazin-2-yl groups. In this way there are avoided deposits on the die and odor annoyance.