Surface acoustic wave devices and method of manufacture thereof
US4672254A · kind A · utility
88Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1985 |
| Grant date | Jun 9, 1987 |
| Priority date | — |
| Expiry date | Oct 11, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A phase and amplitude compensated surface acoustic wave (SAW) structure is described in which computer controlled compensation is achieved by laser chemical etching of selective portions of a compound chemical film deposited on the surface of a piezoelectric SAW substrate in the path of propagation. The compound film comprises a layer of amplitude attenuating cermet material formed on the substrate and a phase compensating layer of molybdenum formed over the cermet material and in contact with the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.