Integrated circuit packages
US4672418A · kind A · utility
35Cited by
6References
12Claims
0Family size
Inventors
Key dates
| Filing date | Apr 8, 1985 |
| Grant date | Jun 9, 1987 |
| Priority date | — |
| Expiry date | Apr 8, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package including a lead frame (11) sealed between base and cap portions (1 and 3) of the package enclosure. Outwards of the seal each lead (13) in the frame (11) follows an angled path so that manipulation of leads outside the package is unlikely to damage the seal. The angling of the leads (13) is effected by appropriately shaping the cap and base parts (1 and 3) of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.