Detector array module fabrication process
US4672737A · kind A · utility
65Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 1985 |
| Grant date | Jun 16, 1987 |
| Priority date | — |
| Expiry date | Aug 2, 2005 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A photo-detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each plane is etched to cut back the semiconductor material, then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.