Method for preparing a printed circuit board
US4673458A · kind A · utility
24Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1986 |
| Grant date | Jun 16, 1987 |
| Priority date | — |
| Expiry date | Mar 10, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.