Patent · US Expired

Fluidized bed heater for semiconductor processing

US4673799A · kind A · utility

10Cited by
7References
5Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 1, 1985
Grant dateJun 16, 1987
Priority date
Expiry dateMar 1, 2005

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB01J2208/00415
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A fluidized bed heater for uniformly raising the surface temperature of semiconductor wafers. The heater includes a mantle having at least one planar surface for supporting wafers, a bed of particles adjacent the mantle which is fluidized by passing a gas through the particle bed, and a bed heater which heats the bed particles to a uniform temperature so that wafers supported on the planar surface are heated to a uniform temperature. A reactor is also described which contains a reactor chamber for processing semiconductor wafers and a fluidized bed heater for uniformly heating semiconductor wafers in the reactor chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.