Selectively plating apparatus for forming an annular coated area
US4675093A · kind A · utility
0Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1986 |
| Grant date | Jun 23, 1987 |
| Priority date | — |
| Expiry date | Jan 29, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention involves a selectively plating apparatus for forming an annular area. The apparatus is particularly characterized by including the inner and outer mask members which cooperate to define the annular areas to be coated. It enables the automatic operation for forming the annular coated areas and is very effective for the mass production of, for example, lead frames.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.