Stabilization of intraconnections and interfaces
US4675466A · kind A · utility
5Cited by
2References
23Claims
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Key dates
| Filing date | Apr 5, 1986 |
| Grant date | Jun 23, 1987 |
| Priority date | — |
| Expiry date | Apr 5, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
Stabilization of energy sensitive semiconductive devices by forming initial electrodes which are exposed through an overlying layer of semiconductor, dipping the exposed electrodes in solutions containing specified chemicals, such as metallic ion solutions of nickel, cobalt, chromium and related metals, followed by rinsing, drying and the final deposition of an overlying electrode by metallization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.