Integrated circuit package and seal therefor
US4675472A · kind A · utility
23Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1986 |
| Grant date | Jun 23, 1987 |
| Priority date | — |
| Expiry date | Aug 4, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package having a substrate of ceramic material having a cavity therein, a resilient seal rim connected to the substrate, a lid that may be inserted within said rim and a band of shape-memory alloy surrounding the rim to compress the rim into contact with the lid to seal the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.