Heat distributing diode mounting assembly
US4675785A · kind A · utility
11Cited by
6References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 31, 1986 |
| Grant date | Jun 23, 1987 |
| Priority date | — |
| Expiry date | Jul 31, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A diode assembly includes a base plate in which a plurality of diodes are mounted in a circle, uniformly spaced. A heat pipe within the diode circle extends perpendicular to the plate and is surrounded by radiating, heat-dissipating fins extending radially outwardly to support rings. Insulators mounted on these support rings support conductive straps which are connected through fuses to the other sides of the diodes. The assembly provides complete electrical and thermal symmetry for the diodes. Three such assemblies can be mounted on a single, triangular base plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.