Patent · US Expired

Multi-layer circuit board

US4675788A · kind A · utility

13Cited by

6References

12Claims

0Family size

Assignee

Schroff GmbH · DE

Inventors

Wolfram Breitling · Sachsenheim, DE
Werner Sonnabend · Neuenbürg, DE

Key dates

Filing date	Jul 17, 1985
Grant date	Jun 23, 1987
Priority date	—
Expiry date	Jul 17, 2005

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/09809
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A multi-layer circuit board which includes at least two boards carrying conductors and a shielding foil interposed between the two boards. The circuit board is provided with a through hole including a metallic lining in electrical connection with the shielding foil. The lining includes an insulating layer on which a conductive metal layer is disposed. The metal layer, electrically separated from the lining by the insulating layer, is in electrical connection at respective ends thereof with the conductors. By virtue of this arrangement a coaxial design of a through hole results thereby permitting a total decoupling with respect to adjacent or neighboring through hole connections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.