Stabilized mask assembly for direct deposition of a thin film pattern onto a substrate
US4676193A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1985 |
| Grant date | Jun 30, 1987 |
| Priority date | — |
| Expiry date | Jul 15, 2005 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/042
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A stabilized mask assembly for direct deposition of a thin film pattern onto a substrate having a dimensionally stabilized mask supporting frame which includes an opening extending therethrough and defining a surface extending circumferentially around the opening, a relatively thin, substantially planar mask having a predetermined yield strength and selected geometrical shape and dimension wherein the mask is positioned adjacent the opening with the periphery of the mask circumferentially contiguous the circumferentially extending surface and wherein the mask has at least one aperture extending therethrough and arranged in a predetermined location defining a thin film pattern, and a securing device for rigidly affixing the periphery of the mask to the circumferentially extending surface with a substantially uniform tension applied to and in the plane of the mask and wherein the tension has a magnitude which establishes a stress on the mask during use which is less than the predetermined yield strength of the mask over a temperature range of a deposition process including operating temperatures of a deposition environment and being adapted to maintain a tension thereon of sufficient…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.