Patent · US Expired

Electronic chip-carrier heat sinks

US4679118A · kind A · utility

129Cited by

4References

6Claims

0Family size

Assignee

Aavid Engineering, Inc. · US

Inventors

Philip A. Johnson · Beaverton, US
Alfred F. McCarthy · Laconia, US

Key dates

Filing date	Jul 28, 1986
Grant date	Jul 7, 1987
Priority date	—
Expiry date	Jul 28, 2006

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both mechanically holds the package securely mated with a multi-pin socket and also cools the package by way of an integrated array of heat-radiating elements; edge clasping of the cap with a chip-carrying socket avoids interference with needed conduction of heat away from central areas of the package and cap.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.