Solder-bearing leads
US4679889A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 1985 |
| Grant date | Jul 14, 1987 |
| Priority date | — |
| Expiry date | Oct 31, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a solder-bearing lead for attachment to a contact pad on a printed circuit board or like substrate, or for mounting a circuit component on a substrate, suitable for being continuously stamped from a thick strip of metal at high speed, with an improved arrangement for holding the solder mass to provide the necessary solder for a soldered joint, without weakening the lead. Instead of retaining the solder mass by means of a finger struck from the elongated body of the lead (which for narrow leads might only weakly retain the solder and also weaken the lead by unduly reducing its already small cross-section), the solder mass is retained by one or more pairs of integral tabs or ears initially extending laterally from the elongated blank body, and then bent to form a solder-retaining channel in which the tabs may stake the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.