Patent · US Expired

Passive mold cooling and heating system

US4680001A · kind A · utility

34Cited by
6References
11Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 10, 1986
Grant dateJul 14, 1987
Priority date
Expiry dateFeb 10, 2006

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C45/7306
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A mold for molding articles of plastic or other like materials, having a plurality of vertically extending internal passages, is connected by inlet and return conduits into a closed loop that includes a heat exchanger partially filled with a liquid supply of a cooling fluid or a heating fluid. For cooling the heat exchanger is positioned with its liquid level above the top of the mold, the inlet conduit connects the lower part of the heat exchanger, below the liquid level, to the lower ends of the mold passages, and the return conduit connects the upper ends of the mold passages to the upper part of the heat exchanger; for heating these relationships are reversed. In operation the fluid changes its physical state at critical points in the mold passages, going from liquid to vapor for cooling and from vapor to liquid for heating; circulation in the closed loop is in response to the effect of gravity. Operation of the heat exchanger is controlled to maintain a controlled pressure in the closed loop.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.