Dielectric materials
US4680220A · kind A · utility
76Cited by
1References
35Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 1985 |
| Grant date | Jul 14, 1987 |
| Priority date | — |
| Expiry date | Feb 26, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Dielectric materials having low dielectric constant are provided, the materials comprising fabrics impregnated with thermosetting resins, at least a portion of the fibers in the fabrics being fluorocarbon fibers. Also provided is a method of manufacture of these dielectric materials. The dielectric materials are useful in the fabrication of multilayer printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.