Reaction injection molding pressure developing and balancing circuit
US4681137A · kind A · utility
1Cited by
9References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 1986 |
| Grant date | Jul 21, 1987 |
| Priority date | — |
| Expiry date | May 7, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/86043
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A pressure developing and balancing circuit for use with chopped glass fibers in reaction injection molding eliminating high pressure drop valving of glass filled liquid component materials which normally create serious heating and valve erosion wear problems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.